Reported by Joerg Reisenweber, Nov 21, 2013
http://www.micron.com/~/media/Documents/Products/Data Sheet/DRAM/Mobile DRAM/Low-Power DRAM/LPDDR/70-series/T79M_2Gb_mobile_lpddr_sdram.pdf seems to fit. ToDo: ask if micron can certify it for DM3730.
Comment 1 by Joerg Reisenweber, Nov 21, 2013
I don't get it :-S a) I missed the huge "2Gb" in that datasheet b) the chip "MT46H256M32L4JV-5 IT" is announced as "density 8Gb" http://www.micron.com/parts/dram/mobile-ddr-sdram/mt46h256m32l4jv-5-i t?pc=%7B77C6853B-2F4D-4E62-A2F8-7B42387D1533%7D
Comment 2 by Joerg Reisenweber, Nov 22, 2013
Comment 3 by Joerg Reisenweber, Dec 3, 2013
When sourcing MOQ:1000, will we be able to get a dozen of those cut from tape and packaged in separate moisture protection bags? We don't want to open the 1000-bag and start the 72h period to solder those 1000 once they got exposed to environment
Comment 4 by Nikolaus Schaller, Dec 3, 2013
Not a big issue. Chips not used can be resealed. And if they are stored for let's say 1 year they will be "baked" i.e. dried at 120C for 24 hours and can be soldered like new ones. Well, we loose the warranty by the manufacturer but in the GTA04 project we did not see any issues that could be traced back to that procedure. It may become relevant when increasing yield from 99% to 99,1% - which is 1k less failures if we produce 1 Mio units.
Comment 5 by Joerg Reisenweber, Dec 3, 2013
for baking we also lose the tape iiuc. Needs repackaging to trays.
Comment 6 by Nikolaus Schaller, Dec 3, 2013
Micron memory chips, TI CPUs and UMTS modules already come in trays.
Comment 7 by Joerg Reisenweber, Dec 3, 2013
Comment 8 by Joerg Reisenweber, Dec 10, 2013
56 available. right one? http://parts.arrow.com/item/detail/micron-technology/mt29c8g96mazbadj v-5wt#npcM
Comment 9 by Joerg Reisenweber, Dec 10, 2013
http://parts.arrow.com/item/detail/micron-technology/mt46h256m32l4jv- 5wtb#pyFg sorry c&p error (wish I could edit tickets)
Comment 10 by Nikolaus Schaller, Jun 25, 2014
http://www.linkedin.com/groups/WTB-used-memory-cards-large-970997.S.2 32936226 SAMSUNG KCE00E00CA–A506 168 12x12 _( Combo 8GB DDR + 4GB NAND Flash FBGA168 ) http://www.netcomponents.com/sitemap/KCE00E00CA-A506.html Spotted in a dead N9 So we CAN get N9 PoP (can we?)
Comment 11 by Joerg Reisenweber, Jul 16, 2014
started inquiries. seekic seems of low reputation, hobid had at least one positive comment on EE forums. See attached file
- hobid-inquiry2.jpeg - 102.46 kB
Comment 12 by Joerg Reisenweber, May 13, 2015
KCE00E00CA-506 tested and sourced. Risk component with poor availability, needs close tracking and early sourcing Anyway ticket closed for now