GTA04b7/Neo900

Issue 572: AV connector OMTP/AHJ mux (dual standard)

Reported by Joerg Reisenweber, Mar 21, 2014

AV receptacle should be able to handle both OMTP (old Nokia style 
incl N900, most other devices with 4pin 3.5mm AV) and AHJ (Apple, 
most Android phones) 
The difference is swap between pin3(ring2) and pin4(GND+sleeve).

Consider TI
TS3A226AE http://www.ti.com/product/ts3a226ae
TS3A225E http://www.ti.com/product/TS3A225E



references:
* tmo thread:
http://talk.maemo.org/showthread.php?p=1406868#post1406868 #1690
http://talk.maemo.org/showthread.php?p=1406995#post1406995 #1692
http://talk.maemo.org/showthread.php?p=1407054#post1407054 #1694
* OMTP whitepaper / spec:
http://www.gsma.com/newsroom/wp-content/uploads/2012/03/omtplocalconn
ectivitywiredanalogueaudiov10.pdf
* headphone jack standards:
<http://en.wikipedia.org/wiki/Phone_connector_
(audio)#TRRS_Standards>

Comment 1 by Joerg Reisenweber, Mar 21, 2014

Note that in  TS3A225E datasheet (http://www.ti.com/lit/gpn/ts3a225e 
resp 
http://www.ti.com/general/docs/lit/getliterature.tsp?genericPartNumbe
r=ts3a225e&fileType=pdf) there is a massive error in page:21 
table:2 "OMTP" in the columns 
"pin-configuration" - the other data for OMAP n that table 
seems right.

Comment 2 by Nikolaus Schaller, Mar 22, 2014

Main differences between 225e and 226ae:

225e has additional I2C interface and has +/- symmetrical interface 
for MIC.

226ae has no I2C and references MIC to GND - and is only available 
in YFF-WCSP (0.4mm BGA) package.

Fortunately the pin layout of the YFF package is in a way that it is 
possible to use a single layer 125um board.

Current choice for Pyra and Neo900 is TS3A225ERTE (QFN package)

Created: 3 years 7 days ago by Joerg Reisenweber

Updated: 3 years 6 days ago

Status: New

Owner: Joerg Reisenweber

Followed by: 1 person

Labels:
Type:Enhancement
Priority:High