Reported by Joerg Reisenweber, Mar 21, 2014
AV receptacle should be able to handle both OMTP (old Nokia style incl N900, most other devices with 4pin 3.5mm AV) and AHJ (Apple, most Android phones) The difference is swap between pin3(ring2) and pin4(GND+sleeve). Consider TI TS3A226AE http://www.ti.com/product/ts3a226ae TS3A225E http://www.ti.com/product/TS3A225E references: * tmo thread: http://talk.maemo.org/showthread.php?p=1406868#post1406868 #1690 http://talk.maemo.org/showthread.php?p=1406995#post1406995 #1692 http://talk.maemo.org/showthread.php?p=1407054#post1407054 #1694 * OMTP whitepaper / spec: http://www.gsma.com/newsroom/wp-content/uploads/2012/03/omtplocalconn ectivitywiredanalogueaudiov10.pdf * headphone jack standards: <http://en.wikipedia.org/wiki/Phone_connector_ (audio)#TRRS_Standards>
Comment 1 by Joerg Reisenweber, Mar 21, 2014
Note that in TS3A225E datasheet (http://www.ti.com/lit/gpn/ts3a225e resp http://www.ti.com/general/docs/lit/getliterature.tsp?genericPartNumbe r=ts3a225e&fileType=pdf) there is a massive error in page:21 table:2 "OMTP" in the columns "pin-configuration" - the other data for OMAP n that table seems right.
Comment 2 by Nikolaus Schaller, Mar 22, 2014
Main differences between 225e and 226ae: 225e has additional I2C interface and has +/- symmetrical interface for MIC. 226ae has no I2C and references MIC to GND - and is only available in YFF-WCSP (0.4mm BGA) package. Fortunately the pin layout of the YFF package is in a way that it is possible to use a single layer 125um board. Current choice for Pyra and Neo900 is TS3A225ERTE (QFN package)