GTA04b7/Neo900

Issue 516: [Neo900] PoP RAM 1GByte

Reported by Joerg Reisenweber, Nov 21, 2013

http://www.micron.com/~/media/Documents/Products/Data 
Sheet/DRAM/Mobile DRAM/Low-Power 
DRAM/LPDDR/70-series/T79M_2Gb_mobile_lpddr_sdram.pdf
seems to fit.

ToDo: ask if micron can certify it for DM3730.

Comment 1 by Joerg Reisenweber, Nov 21, 2013

I don't get it :-S
a) I missed the huge "2Gb" in that datasheet
b) the chip "MT46H256M32L4JV-5 IT" is announced as 
"density 8Gb"
http://www.micron.com/parts/dram/mobile-ddr-sdram/mt46h256m32l4jv-5-i
t?pc=%7B77C6853B-2F4D-4E62-A2F8-7B42387D1533%7D

Comment 2 by Joerg Reisenweber, Nov 22, 2013

"verification":
http://e2e.ti.com/support/dsp/omap_applications_processors/f/447/t/16
8425.aspx

Comment 3 by Joerg Reisenweber, Dec 3, 2013

When sourcing MOQ:1000, will we be able to get a dozen of those cut 
from tape and packaged in separate moisture protection bags?
We don't want to open the 1000-bag and start the 72h period to 
solder those 1000 once they got exposed to environment

Comment 4 by Nikolaus Schaller, Dec 3, 2013

Not a big issue. Chips not used can be resealed. And if they are 
stored for let's say 1 year they will be "baked" i.e. 
dried at 120C for 24 hours and can be soldered like new ones. Well, 
we loose the warranty by the manufacturer but in the GTA04 project 
we did not see any issues that could be traced back to that 
procedure. It may become relevant when increasing yield from 99% to 
99,1% - which is 1k less failures if we produce 1 Mio units.

Comment 5 by Joerg Reisenweber, Dec 3, 2013

for baking we also lose the tape iiuc. Needs repackaging to trays.

Comment 6 by Nikolaus Schaller, Dec 3, 2013

Micron memory chips, TI CPUs and UMTS modules already come in trays.

Comment 8 by Joerg Reisenweber, Dec 10, 2013

56 available. right one?
http://parts.arrow.com/item/detail/micron-technology/mt29c8g96mazbadj
v-5wt#npcM

Comment 9 by Joerg Reisenweber, Dec 10, 2013

http://parts.arrow.com/item/detail/micron-technology/mt46h256m32l4jv-
5wtb#pyFg
sorry c&p error (wish I could edit tickets)

Comment 10 by Nikolaus Schaller, Jun 25, 2014

http://www.linkedin.com/groups/WTB-used-memory-cards-large-970997.S.2
32936226
SAMSUNG KCE00E00CA–A506 168 12x12 _( Combo 8GB DDR + 4GB NAND Flash 
FBGA168 ) 
http://www.netcomponents.com/sitemap/KCE00E00CA-A506.html

Spotted in a dead N9

So we CAN get N9 PoP (can we?)

Comment 11 by Joerg Reisenweber, Jul 16, 2014

started inquiries. seekic seems of low reputation, hobid had at 
least one positive comment on EE forums.
See attached file

Comment 12 by Joerg Reisenweber, May 13, 2015

KCE00E00CA-506 tested and sourced.
Risk component with poor availability, needs close tracking and 
early sourcing

Anyway ticket closed for now
Status: Fixed

Created: 10 years 11 months ago by Joerg Reisenweber

Updated: 9 years 5 months ago

Status: Fixed

Followed by: 1 person

Labels:
Priority:Medium
Type:Defect